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Rogers MAGTREX 555 高阻抗层压板是一种先进的电路板材料，专为天线设计和其他高频应用而设计。这种材料的特点在于其可控的磁导率和介电常数，使其成为市场上首款商用低损耗层压板。MAGTREX 555 层压板的设计旨在提供设计灵活性和优化，帮助天线设计人员扩展其设计的贸易空间。
| Standard Thicknesses | Standard Panel Size | standard Cladding | |
| 0.040°(1.02mm)+/-0.002” 0.060”(1.52mm)+/-0.003” 0.080”(2.03mm)+/-0.004" 0.100°(2.54mm)+/-0.005” | 0.140°(3.56mm)+/-0.007” 0.200”(5.08mm)+/-0.010" 0.260”(6.60mm)+/-0.013 | 2*X18*(305X457mm） | lectrodeposited Copper Foil 1 oz.(35μm) Unclad |
MAGTREX 555
材料的核心是由专有的低损耗、高电阻率陶瓷填料和高温热塑性基体制成，这种组合产生了一个在机械和电气上都稳定的系统。层压板的X/Y轴磁导率和介电常数紧密匹配，分别为6和6.5，且在低于500
MHz的频率下具有低磁损耗和介电损耗。此外，MAGTREX 555 层压板具有低X、Y、Z
CTE(热膨胀系数)，与铜紧密匹配，确保了热可靠性，厚度范围从40至260密耳，并可提供带或不带铜包层。
这种层压板特别适合于VHF和UHF天线的小型化设计，同时保持了与更大设计相当的带宽。MAGTREX 555 层压板的制造工艺基于陶瓷/PTFE复合材料系统，类似于罗杰斯公司知名的RT/duroid层压板。
MAGTREX 555 层压板的特性包括匹配的磁导率和介电常数、高小型化系数、聚四氟乙烯复合层压板、低吸湿性、低介电损耗和低磁损耗(低于500MHz)。这些特性带来了多方面的好处，包括基板阻抗与空气匹配、天线小型化和带宽改进、灵活且贴合的设计、环境稳定的电气性能以及高天线效率。
MAGTREX 555 Typical Value Property | Direction X=CMD Y=MD | Inits Condition Test Method | |||||
| Electric &Magnetic Properties | |||||||
| Dielectric Constant,(?) | 6.5 | X/Y | 400 MHz | Coaxial Airline 1"NRW Extraction | |||
| Dielectric Constant,(ε) | 5.3 | Z | 400 MHz | FSR,IPC-TM-650,2.5.5.6 | |||
| Permeability (μ) | 6.0 | X/Y | 400 MHz | Coaxial Airline 1"NRW Extraction | |||
| Dielectric Loss Tangen | 0.01 | X/Y | 400 MHz | Coaxial Airline 1"NRW Extraction | |||
| Magnetic Loss Tangen | <.05 | X/Y | 400 MHz | Coaxial Airline 1"NRW Extraction | |||
| Thermal Coefficent of Vs,μ | ~+1000 | ppy℃ | 250 MHz,0-100C | FSR,IPC-TM-650,2.5.5.6 | |||
| Thermal Coefficient of s | TBD | TBD | pp/℃ | TBD MHz | TBD | ||
| Thermal Coeffhidient of μ | TBD | TBD | pp/℃ | TBD MHz | TBD | ||
| Volume Resistivity | 615 | MO-CM | Condition A | IPC-TM-6502.5.17.1 | |||
| Surface Resistivity | 174 | MQ | Condition A | PC-TM-6502.5.17.1 | |||
| Electrical Strength | 131 | Z | V/mil | PC-TM-6502.5.6.2 | |||
| Dielectric Breakdown | 14.35 | kV | IPC-TM-6502.5.6 | ||||
| Curie Temperature | 241 | C | VSM | ||||
| f1(see Figures 1&2) | 499 | MHz | 23C | Coaxial Airline 1"NRW Extraction | |||
| f2 (see Figures 1&2) | 715 | MHz | 23C | Coaxial Airline 1"NRW Extraction | |||
| f3(see Figures 1&2) | 3900 | MHz | 23C | Coaxial Airline 1"NRW Extraction | |||
| ft(see Figures 1&2) | 2800 | MHz | 23C | Coaxial Airline 1"NRW Extraction | |||
| Mechanical Properties | |||||||
| Peel Strength | >3.1 | pli | 1oz ED After Solder Float | IPC-TM-6502.4.8 | |||
| Dimensional Stability | 0.15 0.18 | x Y | % | Condition A 0.50"sample thickness | IPC-TM-6502.2.4 | ||
| Flexural Strength | 10.6(1.54) 10.8(1.57) | x Y | MPa (ksi) | ASTM D790 | |||
| Flexural Modulus | 550(79.8) 572(82.9 | x Y | MPa (ksi) | ASTM D790 | |||
| Tensile Strength | 8.6(1.25) 6.7 (0.97) | x Y | MPa (ksi) | ASTM D638 | |||
| Tensile Modulus | 1482 (214.9 1502 (217.7) | x Y | MPa (ksi) | ASTM D638 | |||
| Compressive Strength | >143.8 (>20.8) | MPa(ksi | ASTM D3410/D3410M-16 | ||||
| Compressive Modulus | 2092 (303.4) | MPa (ksi | ASTM D3410/D3410M-16 | ||||
| Poisson's Ratio | 0.3685 | ASTM D3039/D3039M-14 | |||||
| Impact Strength | 9.77 (4.65) | kJ/m? (ft lb/in? | ASTM D256-10e1 | ||||
| Thermal Properties | |||||||
| Coefficient of Thermal Expansion | 22 | X | ppm/℃ | -55 to 288℃ | PCTM-6502.4.41 | ||
| 25 | Y | ||||||
| 25 | Z | ||||||
| 0.47 | W/mK | -55 to 288℃ | ASTM C518 | ||||
| Thermal Conductivity Decomposition Temperature (Td) | 500 | C | 5%weight loss | IPC-TM-6502.3.40 | |||
| T260 | >30 | min | TMA | IPC-TM-6502.4.24.1 | |||
| T288 | >30 | min | TMA | IPC-TM-6502.4.24.1 | |||
| Physical Properties | |||||||
| N/A | |||||||
| Flammability | <.25 | % | D48/50 | PCTM-6502.6.2.1 | |||
| Moisture Absorption | 3.45 | g/cm? | C-24/23/50 | ASTM D792 Method A | |||
| Density | .765 | J/g/℃ | DSC | ASTM E1269-11 | |||
| Specific Lead Free | Heat Process | Compatible | PASS | ||||
| Outgassing | 0.02 | % | TML/CVCM | ASTM E595-15 | |||
 Fungus Resistance | PASS | IPC-TM-6502.6.1 | |||||
